1. Thousands of metal developed by the lead-free solder paste is a very small surface oxidation powder and chemical stability superior flux combination;

2. Not only high reliability, with good storage stability, and has good weldability;

3. It is characterized by the solder does not produce tiny solder ball;

4. But also to solve the problem caused by the high melting point heat resistance and so on, is a new generation of environmentally friendly corresponding to the new lead-free solder paste products;

5. High reliability, suitable for high temperature preheating, printing stability, low residue.