In general terms, reflow soldering is used in the SMT process to solder surface-mount electronic components; wave soldering is used to solder the active pin-in components to the circuit board. Described below by hope we can understand.

      Reflow, also known as reflow, refers to the re-melting by pre-assigned to the printed circuit board solder paste paste to achieve surface mount components or solder pins and printed circuit board pad mechanical Electrical connection of the soldering, in order to achieve the reliability of the circuit function; Wave soldering is the melting of the solder, the electric pump or electromagnetic pump jet into the design requirements of the solder peak, so pre-equipped with electronic components Of the PCB through the solder wave peak, to achieve components or solder pins and printed circuit board pad mechanical and electrical connections between the soldering. These two welding methods as the industry's high-end welding technology, what is the difference between them?

      Reflow soldering is a group or point-by-point soldering process where a suitable amount of solder and a suitable form of solder are pre-applied to the soldering area of the PCB and then the surface mount components are placed and reflowed to meet the soldering requirements with an external heat source. Reflow soldering compared with wave soldering has the following characteristics:

      First, reflow does not need to be as soldering soldering components as required, so the thermal shock suffered by components is small;

      Second, the reflow soldering only cast on the required parts, greatly saving the use of solder;

      Third, reflow soldering can control the amount of solder, bridging and other defects to avoid;

      Fourth, when the component placement affixed to a certain deviation, due to the role of molten solder surface tension, as long as the solder cast position is correct, reflow soldering this tiny deviation automatically corrected so that the components fixed in the correct position;

      Fifth, the local heating heat source can be used in the same substrate with a different reflow soldering process for welding;

      Sixth, the solder will not be mixed in with no matter, the use of solder paste reflow soldering can correctly maintain the composition of the solder.

      Wave soldering is a kind of automatic soldering equipment that solders the components of plugs through high temperature heating. From the function, wave soldering is divided into lead wave soldering, lead wave soldering and nitrogen wave soldering. From the structure, one wave soldering is divided into Spray, preheat, tin stove, cooling four parts.

      Wave soldering method: Wave soldering is the tin on the wave soldering tin stove will melt the formation of solder wave soldering components

      Wave soldering refers to the melting of solder (pewter), the electric pump or electromagnetic pump jet into the design requirements of the solder peak, but also by injecting nitrogen into the solder pool to form, so pre-equipped with components PCB through the solder wave crest, to achieve components or solder pins and printed circuit board pad mechanical and electrical connection between the soldering. Wave soldering systems can be divided into many types based on the different geometries used by the machine. Wave soldering process: Insert the component into the corresponding component hole → pre-coated flux → prebaking (temperature 90-1000C, length 1-1.2m) → wave soldering (220-2400C) → remove the extra plug pin → check.

The difference between reflow and wave soldering:

      1, wave soldering tin tank is tin solution into a liquid state, the use of motor agitation to form a peak, so that the PCB and parts are welded together, generally used in the hand insert welding and SMT glue board. Reflow soldering is mainly used in SMT industry, it is through the hot air or other thermal radiation conduction, the solder paste printed on the PCB melting and parts welding.

      2, different technology: wave soldering flux should be sprayed, and then after preheating, welding, cooling zone. Reflow through the preheating zone, reflow zone, cooling zone. In addition, the wave soldering applicable to the hand insert board and plastic sheeting, and requires all components to be heat-resistant, over the crest of the surface can not have SMT solder paste components, SMT solder paste board can only be over reflow, not Wave soldering.

Reflow soldering wave soldering differences in a simple way

      Reflow soldering: Mechanical and electrical connection between the surface mount component terminals or pins and the PCB pads by remelting the cream solder paste previously dispensed onto the pads on the PCB. It is SMT (surface mount technology) in a step.

Wave-soldering: Wave soldering is a kind of automatic soldering equipment that solders the components of plugs through high-temperature heating. From the function, wave soldering is divided i