BGA steel mesh with laser drilling, higher accuracy, can be used for the same size of the ball Taiwan.

Another 0.3 0.4 0.5 0.6 0.76 universal steel

Common sizes are: 75 * 75 79 * 79 99 * 99

Claim:

Can be customized with this ball Taiwan supporting the dedicated BGA ball grid network desktop PC motherboards, laptop motherboards, graphics cards on the BGA ball grid generally only reported on the BGA models can be customized, other aspects of the BGA chip, BGA specification information to us, or send us the BGA chip can be customized.

Delivery deadline and precautions:

Delivery time is generally 1 ~ 2 days. (Note: If you have already had a planting table on hand, because different suppliers have different sizes of planting table, so when customizing BGA, please tell us the size and net Positioning the spacing of the hole, otherwise it may not match with the planting platform on your hand. There is no need to consider the positioning of the stencil spacing of the stencil without the planting table).

important hint:

1: Lead tin melting point of 183 degrees Celsius. Alloy (Tin 63% Lead 37%).

2: Lead-free tin melting point of 217 degrees Celsius. Alloy (tin 96.5% silver 3% copper 0.5%).

3: Better content of tin pewter and silver is normal. Melting point is normal.

4: when heated directly with the air gun. Adjust the air gun temperature. Without too high temperature. Otherwise, deformation caused by stencil.