Model: GL08W005

That is, the same side of the same circuit board with red plastic and solder paste process for the production process.

Need to open 2 stencils, one with paste, one with a red plastic; according to the actual situation of the circuit board selection SMT stencil production process, two steel nets require accurate alignment, to prevent the second The first printing will be destroyed when printing, can not achieve the desired effect.

Local thickening of the template to increase or decrease the amount of solder when a particular component is soldered and to avoid local bumps on the PCB to ensure that the PCB and the template in close contact during the printing process template is particularly suitable for perforated reflow soldering process Component reflow soldering).