Model: Bi58

1. This type of general disposable SAC305 lead-free solder paste, suitable for SMT process;

2. The printing performance is consistent, good repeatability;

3 in the template shelf life is long, the process window wide, BGA very few holes (Void<8%);

4. Special flux designed to effectively inhibit tin splashes, solves the problem of gold finger on the tin;

5. Suitable for high-performance mobile phones and other products of the welding;